Experimental Study on Cluster Magnetorheological Variable Gap Dynamic Pressure Planarization Finishing

In order to improve the processing effect of cluster magnetorheological flattening of optoelectronic wafers, a clustered magnetorheological variable gap dynamic pressure planarization processing method was proposed, and the influence of various process parameters on the processing effect was explored. The comparison test of variable gap dynamic pressure flattening processing and cluster magnetorheological polishing, by detecting the roughness of the processed surface, material removal rate, observing the topography of the processed surface, and the shape change of the flux linkage string in the cluster magnetorheological polishing pad before and after dynamic extrusion , to study the influence of process parameters such as extrusion amplitude, workpiece disk speed, extrusion frequency and minimum machining gap on the machining effect. The experimental results show that the cluster magneto-rheological flattening process is subjected to low-frequency axial vibration of the workpiece. , the magnetic chain string