A composite nanofiller with a nail column void structure to imitate beetle shell fiber to enhance the impact resistance of polyurethane elastomer
Polyurethane elastomer (PUE) is faced with cracking problems under the high-speed impact to limit its application in the protective field. Inspired by a “nail columns"—"nail columns” void structure of chitin fiber on the beetle shell, tetra vinyl polyhedral oligomeric silsesquioxanes (EVPO...
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Veröffentlicht in: | Composites science and technology 2022-04, Vol.221, p.109304, Article 109304 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Polyurethane elastomer (PUE) is faced with cracking problems under the high-speed impact to limit its application in the protective field. Inspired by a “nail columns"—"nail columns” void structure of chitin fiber on the beetle shell, tetra vinyl polyhedral oligomeric silsesquioxanes (EVPOSS) composite multiwalled carbon nanotube (MCNTs) enhanced fillers (PDVBMC and PNHMC) were prepared by different bonding types and used to improve the impact resistance of PUE. The 1.5 wt% PDVBMC or PNHMC reinforced composite PUE exhibited simultaneous enhancements in maximum compression modulus (22.2% and 34.6%), energy absorption (40.1% and 53.7%) and storage modulus (16.5% and 30.6%). The excellent mechanical properties of composite PUE is not only attributed to the enhancement of interface strength between enhanced fillers and PUE matrix but also the bonding strength between enhanced fillers, which can be demonstrated by the differences in energy absorption, storage modulus and bonding fracture energy.
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•EVPOSS/MCNTs with nail column void structure imitate beetle shell was prepared.•Interface between EVPOSS/MCNTs nano-filler was linked by π-π or covalent bonding.•Anti-impact property was affected by bonding strength between nanoparticles.•First-principle calculated the bonding strength between EVPOSS and MCNTs.•Impact energy absorption of two composite PUE was increased by 40.1% and 53.7%. |
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ISSN: | 0266-3538 1879-1050 |
DOI: | 10.1016/j.compscitech.2022.109304 |