Technique for Analyzing Volumetric Defects Using Digital Elevation Model of a Surface

A technique for detecting and analyzing volumetric surface defects has been developed. The technique is based on geomorphometric modeling, in particular, on analyzing the models and maps of a number of morphometric variables (minimum curvature, maximum curvature, mean curvature, Gaussian curvature, unsphericity curvature, etc.) calculated using digital elevation models of a surface. The technique makes it possible to identify areas of the location of individual volumetric defects (cracks, film delamination, shape deviations, etc.), to determine the shape and size of both the defects themselves and the modified areas next to them, and to study defect distribution patterns. The efficiency of the technique is demonstrated by the example of defects on assemblies of silicon-glass and silicon-silicon wafers and on a cracked Ni–W film. The technique can be promising for quality control of manufacturing and diagnostics of damage to various pieces, in particular, of microelectronic products.