Evolution of Microstructure and its Parameters after Deformation of Polycrystalline Cu-Al Alloys with Different Stacking Fault Energy

Transmission electron microscopy (TEM) is used to investigate the evolution of the dislocation substructure after active plastic deformation of copper-aluminum alloys with the aluminum content varying between 0.5–14 at.%. Using TEM images, the types of the dislocation substructure are determined depending on the alloying element concentration and the strain intensity. The parameters of the defect structure, such as average scalar dislocation density, bending and torsion of the crystal lattice, and microtwin density are measured. It is found that the stacking fault energy exerts an effect on the defect accumulation.