Folded MEMS Platform Based on Polymeric Flexible Hinges for 3D Integration of Spatially-Distributed Sensors

This paper introduces a batch fabrication method to manufacture Micro-Electro-Mechanical System (MEMS) platforms for 3D integration of sensors spatially-distributed on a 2D plane. In the heart of the concept is a foldable MEMS structure with polymer hinges which is used to support and guide the assembly of the discrete planar sensors by means of folding them into a 3D shape, like origami, providing controlled distribution of sensors in space. Flexible hinges carrying the electrical interconnects are a critical structural element of the platform and material selection study for those is the main focus of this paper. We analyzed different materials for flexible hinges fabrication, including photo-definable polyimide and parylene-C. Three approaches for sensor integration are presented: 1) co-fabrication; 2) sensor drop-in; and 3) transfer bonding. The prototypes of structures with different flexible hinge materials were fabricated and evaluated based on their mechanical flexibility, chemical compatibility, and material outgassing. Parylene-C exhibited similar or better performances compared to polyimide, demonstrating in each of the experiments a higher degree of thermal flexibility up to 350 °C, a superior chemical resistance against hydrofluoric acid, and 2.9 times lower outgassing. [2020-0301]