Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly -Oriented Nanotwinned Cu

Cu-Cu bonding has the potential to break through the extreme boundary of scaling down chips’ I/Os into the sub-micrometer scale. In this study, we investigated the effect of 2-step bonding on the shear strength and electrical resistance of Cu-Cu microbumps using highly -oriented nanotwinned Cu (nt-C...

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Veröffentlicht in:	Metals (Basel ) 2021-11, Vol.11 (11), p.1864
Hauptverfasser:	Ong, Jia-Juen, Tran, Dinh-Phuc, Yang, Shih-Chi, Shie, Kai-Cheng, Chen, Chih
Format:	Artikel
Sprache:	eng
Schlagworte:	Annealing Bonding strength COVID-19 Ductile fracture Grain boundaries Grain growth Investigations Recrystallization Shear strength Shear tests Shearing
Online-Zugang:	Volltext
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