Maintaining the localized surface plasmon resonance of copper nanoparticles by defective TiO2 thin films

The localized surface plasmon resonance (LSPR) of copper nanoparticles (CuNPs) damps quickly in air due to the easy oxidation of copper atoms. Finding ways to retard the oxidation of CuNPs is critical for the applications based on the LSPR of CuNPs. In this paper, we report on a new method to mainta...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Applied physics. A, Materials science & processing Materials science & processing, 2021-12, Vol.127 (12), Article 930
Hauptverfasser:	Zhao, Shiqi, Cheng, Zhitao, Wang, Shuai, Hao, Hongliang, Fang, Yingcui
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied physics Characterization and Evaluation of Materials Condensed Matter Physics Copper Machines Manufacturing Materials science Nanoparticles Nanotechnology Optical and Electronic Materials Oxidation Physics Physics and Astronomy Processes Rapid Communications Surface plasmon resonance Surfaces and Interfaces Thin Films Titanium dioxide
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The localized surface plasmon resonance (LSPR) of copper nanoparticles (CuNPs) damps quickly in air due to the easy oxidation of copper atoms. Finding ways to retard the oxidation of CuNPs is critical for the applications based on the LSPR of CuNPs. In this paper, we report on a new method to maintaining the LSPR of CuNPs by deposition of CuNPs on TiO 2 thin films in vacuum followed by annealing in nitrogen ambient. The anti-oxidation properties of the CuNPs were improved greatly. In three days, the LSPR intensities at 532 and 633 nm were reduced by only 40 and 32%, respectively. This method is simple and cost-effective.
ISSN:	0947-8396 1432-0630
DOI:	10.1007/s00339-021-05073-9