Curing behavior, mechanical and thermal properties of epoxy‐CeO2 nanocomposites

Nanoparticles have been widely used in the improvement of the mechanical and thermal properties of the epoxy matrix. In this study, the room temperature curing agent composed of acrylic acid and 2,4,6‐trimethyl‐m‐phenylenediamine was mixed with different concentrations of CeO2 nanoparticles into the epoxy resin (E51) to obtain a nanocomposite that can be rapidly molded and cured. Fourier transform infrared spectroscopy and differential scanning calorimetry were used to study the curing behavior of nanocomposites and E51 with the synthesized hardener. Through tensile, flexural, and impact tests, the influence of the nanoparticles content on the mechanical and thermal properties of the prepared composites was discussed. The results showed that the curing process was completed in 4 h. An increase of 78.4% in tensile strength, 81.7% in flexural strength, and 122.0% in elongation were obtained for the cured nanocomposite having 5 wt% CeO2 loading compared to the neat resin. Thermogravimetric analysis result showed that the thermal stability increased with increasing of CeO2 nanofillers content. Finally, the scanning electron microscope revealed the fracture surface morphology of the composites. CeO2‐enhanced epoxy matrix nanocomposites were prepared without external heating by using a novel hardener derived from acrylic acid and 2,4,6‐trimethyl‐m‐phenylenediamine. The obtained nanocomposites display the improved mechanical and thermal properties.