Joining condition dependency of joint resistance in ultrasonic welding of high-temperature superconducting tapes with indium

Ultrasonic welding (UW) is a candidate for easy and simple fabrication of lap joints of high-temperature superconducting (HTS) tapes. Our previous study applied UW to both silver-sheathed BSCCO tapes and copper-stabilized REBCO tapes with indium foil inserted in-between. However, the fabrication was performed with limited joining conditions and critical current, IC, degradation was confirmed in some of the BSCCO tape joints. In this study, we evaluated the joining-condition dependence of joint resistance and IC to improve UW-joined HTS tape performance. Various UW samples using BSCCO and REBCO tapes were prepared with different thicknesses of indium foil, ultrasonic vibration amplitude, joining pressure, joining time, and metal plate arrangement. The results showed that HTS tapes layered between metal plates on the top and bottom can avoid IC degradation even with higher joining energy, however thinner indium foil induced degradation in the BSCCO samples. Through this study, we found the value of joint resistivity only depended on the joining energy per unit joint area. The achieved joint resistivities were 14.0 nΩcm2 for the silver-sheathed BSCCO tapes and 36.1 nΩcm2 for the copper-stabilized REBCO tapes though it was strongly influenced by interface resistivity of the REBCO tape itself.