Thin film evaporative cooling system for high heat flux applications

One of the promising ways of removing large heat fluxes from the surface of heat-stressed elements of electronic devices is the use of evaporating thin layer of liquid film, moving under the action of the gas flow in a flat channel. In this work, a prototype of evaporative cooling system for high heat flux removal with forced circulation of liquid and gas coolants, capable to remove heat flux of up to 1 kW/cm2 and higher is presented. The peculiarity of the test section used in the present work is that the width of the channel is equal to the width of the heating element (1 cm). It was found that the configuration of the test section allows to get higher values of the heat flux compared with the case when the channel width is higher than the width of the heater, since in the latter case some portion of liquid is deviating from the heater due to the thermocapillary forces.