Growth of ZnO thin films at low temperature by plasma-enhanced atomic layer deposition using H2O and O2 plasma oxidants

Zinc oxide (ZnO) thin films were grown at 70 °C by plasma-enhanced atomic layer deposition using H 2 O and O 2 plasmas. Plasma oxidants were used in order to improve the ZnO crystallinity and optoelectronic properties, avoiding high-temperature synthesis. The deposition parameters were optimized to...

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Veröffentlicht in:Journal of materials science. Materials in electronics 2021-08, Vol.32 (15), p.20274-20283
Hauptverfasser: Castillo-Saenz, J. R., Nedev, N., Valdez-Salas, B., Martinez-Puente, M. A., Aguirre-Tostado, F. S., Mendivil-Palma, M. I., Mateos, D., Curiel-Alvarez, M. A., Perez-Landeros, O., Martinez-Guerra, E.
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Sprache:eng
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Zusammenfassung:Zinc oxide (ZnO) thin films were grown at 70 °C by plasma-enhanced atomic layer deposition using H 2 O and O 2 plasmas. Plasma oxidants were used in order to improve the ZnO crystallinity and optoelectronic properties, avoiding high-temperature synthesis. The deposition parameters were optimized to achieve saturation in each reaction step. X-ray photoelectron spectroscopy (XPS) reveals high purity of the obtained ZnO films. X-ray diffraction (XRD) measurements indicate that the grown layers are polycrystalline and that the H 2 O plasma synthesis leads to better crystallinity than the O 2 plasma as inferred from the intensity of the (100) and (002) peaks. The films are with high optical transmission, ~90%, as inferred from UV–visible (UV–Vis) transmittance measurements, and optical band gaps of 3.22 and 3.23 eV for H 2 O and O 2 plasma, respectively. Atomic force microscopy (AFM) indicates that the films are smooth, with an average roughness of ~ 0.22 nm. The growth rate was found to be in the range of 1.2–1.4 Å/cycle. The XPS, XRD, UV–Vis, and AFM results prove the possibility to obtain high-quality ZnO films by O 2 and H 2 O plasma processes at 70 °C with chemical, structural, and optical properties promising for flexible electronics. ZnO films were successfully deposited on polyethylene terephthalate substrates using the optimal conditions for H 2 O plasma process. No damage of the film surface or substrate was observed.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-021-06533-x