Modification of CuI based Hole Transport Material for Solid State DSSC Application

Modification of Hole Transport Material (HTM) with addition of tetramethylethylenediamine (TMED) and ammonium thiocyanate (NH4SCN) have been conducted. Copper Iodide (CuI) were used as the main component of HTM. Several volume variations of TMED (0.1; 0.2; and 0.4 mL) was added into 0.05 M CuI solutions. While TMED: NH4SCN ratio were 1:1,1:2,2:1 also introduced to the dissolved CuI. Optical properties of these materials showed the band gap energy value ranging from 2.38 to 3.79 eV. The conductivity of HTM has been measured and showed the maximum value in CuI added with 0.4 mL TMED = 0.29 S m-1, and ratio of TMED: NH4SCN=2:1 added into CuI = 0.39 S m-1, these value were increased compared to the CuI conductivity itself (0.26 S m-1). The effect of this modification towards SS DSSC efficiency also has been monitored. The SS DSSC construction consists of TiO2 nanorods sensitized by N3, HTM, and platinum as a counter electrode. The performance of SS DSSC showed rising efficiency as follows TiO2|N3|CuI