Hybrid Electrothermal Simulations of GaN HEMT Devices Based on Self-Heating Free Virtual Electrical Characteristics

The electrothermal behavior of gallium nitride (GaN) HEMTs has been simulated by using a hybrid approach in which the problem is solved by coupling together an effective model (for the electrical part) and a 3-D finite element model (for the thermal part). The effective model relies on the estimatio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on electron devices 2021-08, Vol.68 (8), p.3740-3747
Hauptverfasser: Valletta, Antonio, Mussi, Valentina, Rapisarda, Matteo, Lucibello, Andrea, Natali, Marco, Peroni, Marco, Lanzieri, Claudio, Fortunato, Guglielmo, Mariucci, Luigi
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The electrothermal behavior of gallium nitride (GaN) HEMTs has been simulated by using a hybrid approach in which the problem is solved by coupling together an effective model (for the electrical part) and a 3-D finite element model (for the thermal part). The effective model relies on the estimation of the channel current at different temperatures in the absence of thermal gradients. This regime occurs in real devices only during the very initial stage of bias pulses, when self-heating effects are not yet developed, for time intervals shorter than 1 ns. Virtual output electrical characteristic, in which self-heating effects are negligible, have been derived from pulsed measurements of the electrical output characteristics and electrothermal transient simulations. The maximum temperature because of self-heating evaluated by using the virtual output characteristic are substantially higher than those obtained using the short time-pulsed measurements directly. The results have been validated by a comparison with temperature measurements obtained using Raman thermography. This approach has proven to be numerically very efficient and fast, allowing the analysis of realistic complex structures and circuits.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2021.3084547