Die attachment, wire bonding, and encapsulation process in LED packaging: A review

[Display omitted] •Review on die attachment, wire bonding and encapsulation process in LED packaging.•Systematically described and compared all the important factors related to LED packaging.•Thermal management of LED packaging is reported.•Overall tests and challenges in LED research are discussed....

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Veröffentlicht in:	Sensors and actuators. A. Physical. 2021-10, Vol.329, p.112817, Article 112817
Hauptverfasser:	Alim, Md. Abdul, Abdullah, M.Z., Aziz, M.S. Abdul, Kamarudin, R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding Challenges Die attachment Encapsulation Light Light emitting diodes Light sources Light-emitting diode Luminous intensity Nanoparticles Packaging Phosphors Reliability Thermal management Thermodynamic efficiency Wire Wire bonding
Online-Zugang:	Volltext
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