Die attachment, wire bonding, and encapsulation process in LED packaging: A review

[Display omitted] •Review on die attachment, wire bonding and encapsulation process in LED packaging.•Systematically described and compared all the important factors related to LED packaging.•Thermal management of LED packaging is reported.•Overall tests and challenges in LED research are discussed. Light-emitting diodes (LEDs) are considered an ideal substitute for low-efficiency traditional light sources with broad applications in all scientific disciplines. For the past recent years, several developments and innovations have been reported that strengthen the reliability and thermal efficiency of speeding up the LED packaging process. This paper reviews and summarizes various changes and improvements made to die attachment, wire bonding, phosphor coating, encapsulation processes, and thermal management. It also covers the reasons for choosing the materials at every stage of LED packaging. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improved light intensity by different synthesized phosphors.