59‐3: Ultra‐Precise Printing of Micrometer‐Size Interconnectors for High‐Resolution MicroLED Displays

59‐3: Ultra‐Precise Printing of Micrometer‐Size Interconnectors for High‐Resolution MicroLED Displays

We demonstrate a novel ultra‐precise deposition (UPD) technology for printing of micrometer size, mechanically robust, and high‐conductivity interconnectors in micro‐LED (µLED) displays. UPD allows maskless deposition of highly‐concentrated silver inks (even 85% wt. of metal content) on steps much h...

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Veröffentlicht in:SID International Symposium Digest of technical papers 2021-05, Vol.52 (1), p.833-836
Hauptverfasser: Wiatrowska, Aneta, Kowalczewski, Piotr, Fiączyk, Karolina, Witczak, Łukasz, Gadzalińska, Jolanta, Łysień, Mateusz, Schneider, Ludovic, Kosior, Łukasz, Granek, Filip
Format: Artikel
Sprache:eng
Schlagworte:
Displays
Electrical resistivity
high-resolution displays
Inks
Light emitting diodes
micro-LED display
micrometer-size interconnectors
Silver
ultra-precise deposition
Underpotential deposition
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Beschreibung
Zusammenfassung:We demonstrate a novel ultra‐precise deposition (UPD) technology for printing of micrometer size, mechanically robust, and high‐conductivity interconnectors in micro‐LED (µLED) displays. UPD allows maskless deposition of highly‐concentrated silver inks (even 85% wt. of metal content) on steps much higher than the width of the printed structure. The printed feature size is as small as 1 micrometer with the electrical conductivity up to 45% of bulk silver.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.14812