Experimental investigations on metallization in laser-sintered PA12 part using RF sputtering

Owing to its many merits such as reliability, durability, chemical resistance and cost-effectiveness, polyamide 12 (PA12) parts fabricated by selective laser sintering method have been a popular choice in today’s global market. When polymer components are used outside, however, they are exposed to different environmental factors such as moisture and UV radiation, resulting in the development of surface microcracks that significantly affect the material properties. Therefore, this study investigated the use of novel metallization technique in order to enhance the durability of the PA12 components against the accelerated environmental effects. RF magnetron sputtering was used to prepare a thin layer of copper film on the laser-sintered PA12 substrate. In order to determine the sputtering efficiency, the coating was achieved at different deposition power such as 70 W, 100 W and 120 W by retaining the other parameter constant. Furthermore, the flexural property, electrical conductivity, adhesive property, and surface morphology of copper-coated PA12 sections were characterized over a variety of exposure periods, including 15, 30 and 45 days in a controlled environment. It has been found that, copper coated at 120 W of deposition power exhibits better flexural property, good electrical performance and strong bonding strength with the PA12 substrate.