Coarse-grained molecular dynamics simulation of wettability and bleed out of capillary underfill
Coarse-grained molecular dynamics simulations were performed to elucidate the capillary flow process of liquid state capillary underfill (CUF), a sealing resin material. First, we ran a wettability simulation with the CUF consisting of a monomer with small and large fillers. We observed that a certa...
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Veröffentlicht in: | AIP advances 2021-04, Vol.11 (4), p.045112-045112-10 |
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Sprache: | eng |
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Zusammenfassung: | Coarse-grained molecular dynamics simulations were performed to elucidate the capillary flow process of liquid state capillary underfill (CUF), a sealing resin material. First, we ran a wettability simulation with the CUF consisting of a monomer with small and large fillers. We observed that a certain amount of the monomer spreads ahead on the substrate, while many fillers are left inside the droplet. This was confirmed by subsequent mean square deviation (MSD), which showed that the monomer had a higher MSD, 25–45 σ2, than the small and large fillers, which were 0.4–1.4 σ2 and 0.02–0.2 σ2, respectively. When one part of large fillers was replaced with small fillers, small fillers helped accelerate the wetting dynamics because they could move fast. However, when the small filler ratio was high (20%), the MSD of small fillers decreased. Next, we performed a capillary flow simulation in which the CUF flowed between parallel walls and observed that it formed a ridgeline at the upper wall edge. Small fillers contributed to a decreased flow time. However, when the small filler ratio was even higher, the flow time increased. Then, the small fillers slowed themselves down, as shown in the MSD. This is due to an increase in monomer interactions and less space to move. We also found that the bleed length decreased with an increase in the small filler ratio. This study clarified the effects of filler usage on the flow time and bleed length and contributed to new insight into the capillary actions and material design relevant to CUF. |
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ISSN: | 2158-3226 2158-3226 |
DOI: | 10.1063/5.0037400 |