Enhanced Power Delivery Pathfinding for Emerging 3-D Integration Technology

In advanced technology nodes, emerging 3-D integration technology is a promising "More Than Moore" lever for continued scaling of system capability and value. In the 3-D integrated circuit (3-D IC) implementation, the power delivery network (PDN) is crucial to meeting design specifications...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on very large scale integration (VLSI) systems 2021-04, Vol.29 (4), p.591-604
Hauptverfasser:	Kahng, Andrew B., Kang, Seokhyeong, Kim, Seungwon, Xu, Bangqi
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D integration Circuit design Design methodology Design specifications Electric potential Electric power Electricity generation Finite element method Integrated circuit modeling Integrated circuits Logic gates Nodes power delivery routability analysis Routing Solution space Specifications Stacking system pathfinding Through-silicon vias voltage (IR) drop prediction
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!