Enhanced Power Delivery Pathfinding for Emerging 3-D Integration Technology

In advanced technology nodes, emerging 3-D integration technology is a promising "More Than Moore" lever for continued scaling of system capability and value. In the 3-D integrated circuit (3-D IC) implementation, the power delivery network (PDN) is crucial to meeting design specifications. However, determining the optimal PDN design is nontrivial. On the one hand, to meet the voltage (IR) drop requirement, a denser power mesh is desired. On the other hand, to meet the timing requirement, more routing resource is needed for signal routing. Moreover, additional competition between signal routing and power routing is caused by intertier vertical interconnects in 3-D IC. In this article, we propose a power delivery pathfinding methodology for emerging 3-D integration, which seeks to identify a "near-optimal" (or, very high quality) PDN for a given BEOL stack, vertical interconnection, and PDN specification. Compared with previous works, our methodology can explore richer solution spaces as it supports different PDN layer combinations and PDN layer configurations. We develop models for routability and worst IR drop to help reduce iterations between PDN design and circuit design in 3-D IC implementation. We present validations and demonstrate improvement in IR drop and routability with real design blocks in 28- and 14-nm foundry technology nodes.