Thermoelectric Performance Enhancement of n-type Chitosan-Bi2Te2.7Se0.3 Composite Films Using Heterogeneous Grains and Mechanical Pressure
A cost-effective and sustainable approach was used to enhance the thermoelectric performance of printable thermoelectric composite films. Using this approach, we are trying to get rid of the highly energy-intensive (high temperature and long duration) and time-consuming process of manufacturing ther...
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Veröffentlicht in: | Journal of electronic materials 2021-05, Vol.50 (5), p.2840-2851 |
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Sprache: | eng |
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Zusammenfassung: | A cost-effective and sustainable approach was used to enhance the thermoelectric performance of printable thermoelectric composite films. Using this approach, we are trying to get rid of the highly energy-intensive (high temperature and long duration) and time-consuming process of manufacturing thermoelectric generators. This study presents a unique approach of using an environmental-friendly and naturally occurring binder, a heterogeneous particle size distribution and applied mechanical pressure to fabricate
n
-type thermoelectric composite films. Recently spotlighted biomaterial, chitosan, was employed as a binder and it provided enough binding strength to the composite thermoelectric films. Bi
2
Te
2.7
Se
0.3
is an attractive
n
-type thermoelectric material because of its high thermoelectric performance. In this work, we are using two different (100-mesh and 325-mesh)
n
-type Bi
2
Te
2.7
Se
0.3
thermoelectric conductive particles for thermoelectric composite films to understand the role of wide-range particle distribution on thermoelectric composite films. In addition, two different weight ratios (1:2000 and 1:5000) of binders to Bi
2
Te
2.7
Se
0.3
particle and two different applied pressures (150 MPa and 200 MPa) were used for this study. The application of pressure and the use of a heterogenous particle distribution improves the packing density which leads to well-aggregated and coalesced polycrystal bulk-like structure in chitosan 100-mesh (heterogeneous particle distribution) Bi
2
Te
2.7
Se
0.3
thermoelectric composite films and hence improves the overall electrical conductivity and power factor. The best performing
c
omposite film was made with an ink of a 1:2000 weight ratio of binder to100-mesh Bi
2
Te
2.7
Se
0.3
and the applied pressure was 200 MPa. The electrical conductivity was 200 ± 7 S cm
−1
, the Seebeck coefficient was −201 ± 6
µ
V K
−1
, the power factor was 808 ± 69.7
μ
W m
−1
K
−2
, the thermal conductivity was 0.6 W m
−1
K
−1
, and the figure of merit was 0.4 at room temperature. Using energy efficient, sustainable, and cost effective method we achieved
ZT
of 0.40 for
n
-type thermoelectric composite films which is comparable to other printed
n
-type TE composite films. A 2-leg
n
-type Bi
2
Te
2.7
Se
0.3
device was fabricated with a power output of 0.48
μ
W at a closed circuit voltage of 2.1 mV and ∆
T
of 12 K. |
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ISSN: | 0361-5235 1543-186X |
DOI: | 10.1007/s11664-021-08798-8 |