Largely improved thermal conductivity of HDPE composites by building a 3D hybrid fillers network

Hybrid fillers of different geometries are increasingly utilized for the development of functional polymer composites. We herein report the role of HDPE-g-MAH as a compatibilizer for ternary composites consisting of HDPE, multi-walled carbon nanotubes and hexagonal boron nitride (BN). Through melt b...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Composites science and technology 2021-04, Vol.206, p.108666, Article 108666
Hauptverfasser: Feng, Mingjie, Pan, Yamin, Zhang, Mingtao, Gao, Qingsen, Liu, Chuntai, Shen, Changyu, Liu, Xianhu
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Hybrid fillers of different geometries are increasingly utilized for the development of functional polymer composites. We herein report the role of HDPE-g-MAH as a compatibilizer for ternary composites consisting of HDPE, multi-walled carbon nanotubes and hexagonal boron nitride (BN). Through melt blending, HDPE-g-MAH can reduce the agglomeration of fillers and facilitate the formation of network structure. Due to the synergistic effect, ternary composites have demonstrated significantly higher thermal conductivity than those binary composites, and their maximum increase relative to the matrix is 262%. The mechanical performance and thermal conductivity are explained from perspectives of the morphology and crystallinity of the composites. The rheological properties of both binary and ternary composites have close relationship with their thermal conductivity. Although a high fraction of BN nanosheets can greatly reduce the electrical conductivity of ternary composites, they posed little effect on the electromagnetic interference shielding performance, owing to their electrical insulating nature. This research can provide new clues for the development of functional materials. [Display omitted]
ISSN:0266-3538
1879-1050
DOI:10.1016/j.compscitech.2021.108666