Silicon migration seal wafer‐level vacuum encapsulation

Silicon migration seal (SMS) wafer‐level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibi...

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Veröffentlicht in:	Electronics and communications in Japan 2021-03, Vol.104 (1), p.120-125
Hauptverfasser:	Suzuki, Yukio, Dupuit, Victor, Kojima, Toshiya, Kanamori, Yoshiaki, Tanaka, Shuji
Format:	Artikel
Sprache:	eng
Schlagworte:	Electronic packaging Encapsulation Epi‐Seal Hermetic sealing High vacuum hydrogen anneal Sealing Silicon silicon migration vacuum sealing wafer‐level packaging
Online-Zugang:	Volltext
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