Silicon migration seal wafer‐level vacuum encapsulation

Silicon migration seal wafer‐level vacuum encapsulation

Silicon migration seal (SMS) wafer‐level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibi...

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Veröffentlicht in:Electronics and communications in Japan 2021-03, Vol.104 (1), p.120-125
Hauptverfasser: Suzuki, Yukio, Dupuit, Victor, Kojima, Toshiya, Kanamori, Yoshiaki, Tanaka, Shuji
Format: Artikel
Sprache:eng
Schlagworte:
Electronic packaging
Encapsulation
Epi‐Seal
Hermetic sealing
High vacuum
hydrogen anneal
Sealing
Silicon
silicon migration
vacuum sealing
wafer‐level packaging
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Zusammenfassung:Silicon migration seal (SMS) wafer‐level packaging is proposed for high vacuum encapsulation of MEMS. The sealing of vent holes is possible based on silicon surface migration effect at 1100°C in 100% hydrogen ambient without deposition, if the size of the vent holes is properly designed. The feasibility of SMS packaging was experimentally demonstrated using 4‐inch wafers. Hermetic sealing was confirmed after 168 hours from the packaging process by diaphragm displacement in the cap wafer.
ISSN:1942-9533
1942-9541
DOI:10.1002/ecj.12283