Robust and Efficient Pd–Cu Bimetallic Catalysts with Porous Structure for Formic Acid Oxidation and a Mechanistic Study of Electrochemical Dealloying
To obtain highly efficient and robust electrocatalysts for formic acid oxidation, Pd x Cu y /C binary catalysts with porous structures were successfully prepared via electrochemical dealloying. Catalysts with different Pd/Cu atomic ratios were characterized through transmission electron microscopy,...
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Veröffentlicht in: | Electrocatalysis 2021-03, Vol.12 (2), p.117-126 |
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Hauptverfasser: | , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | To obtain highly efficient and robust electrocatalysts for formic acid oxidation, Pd
x
Cu
y
/C binary catalysts with porous structures were successfully prepared via electrochemical dealloying. Catalysts with different Pd/Cu atomic ratios were characterized through transmission electron microscopy, inductively coupled plasma atomic emission spectroscopy, and X-ray diffraction. The optimized dealloyed Pd
1
Cu
4
/C catalyst with a porous structure displayed a catalytic activity of 2611 A g
−1
and high stability (30.5% activity retention under repeated cyclic voltammetric (CV) patrol), whereas a commercial Pd/C-Aldrich benchmark showed a catalytic activity of 785 A g
−1
and retained 16.5% activity. A detailed mechanistic study of electrochemical dealloying was performed. Under repeated CV patrol, Pd-enriched porous architectures evolved from Pd-poor surfaces, accompanied by successive Cu dissolution.
Graphical abstract
Pd
x
Cu
y
/C catalysts were fabricated via a one-pot hydrothermal approach for formic acid oxidation. Mechanism study on the electrochemical dealloying process revealed that the initial Pd-poor surface evolved into porous Pd-enriched architecture due to successive dissolution of Cu. The tentatively optimized D-Pd
1
Cu
4
/C catalyst registered the highest mass activity (2611 A g
−-1
) and specific activity (42.3 A m
−-2
), surpassing that of a commercial Pd/C benchmark (785 A g
−-1
, 25.7 A m
−-2
). |
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ISSN: | 1868-2529 1868-5994 |
DOI: | 10.1007/s12678-020-00632-9 |