Influence of low-temperature annealing temperature on the evolution of the microstructure and mechanical properties of Cu-Cr-Ti-Si alloy strips

The changes in the yield strength and electrical conductivity of a Cu-Cr-Ti-Si alloy strip after rolling at room temperature, annealing at 370 °C, and annealing at 420 °C were investigated. The influence mechanism of the annealing temperature on the microstructure, such as the texture characteristics and dislocation density, was revealed. The results show that compared with the room-temperature rolled state, low-temperature annealing temperature has a significant effect on the mechanical properties and microstructures of the Cu-Cr-Ti-Si alloy strip. After annealing at 370 °C, the yield strength and ultimate tensile strength reach 525 MPa and 544 MPa, respectively. The hardness and electrical conductivity reach 164.5 HV and 84.6% IACS, respectively. In addition, the microstructure of the alloy annealing at 370 °C exhibits a higher dislocation density and a higher texture intensity compared to the sample rolled at room temperature. The results provide theoretical guidance for optimization of the heat treatment process of high-precision Cu-Cr-Ti-Si alloy strips.