Effect of surface-active metallic impurities on diffusion creep of polycrystalline copper

•It was measured a concentration dependence viscosity of copper-based solid solutions.•The viscosity strongly depends from the surface activity of second component.•The concentration dependence has a maximum for low-melting surface active impurities. We analyzed the changes in diffusional creep in p...

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Veröffentlicht in:	Materials letters 2021-01, Vol.282, p.128811, Article 128811
1. Verfasser:	Zhevnenko, S.N.
Format:	Artikel
Sprache:	eng
Schlagworte:	Antimony Bismuth Copper Copper-based solid solutions Creep rate Diffusion rate Diffusional creep Dilution Impurities Interface controlled diffusional creep Lead Low concentrations Materials science Polycrystals Solid solutions Strain rate The Nabarro–Herring model Tin
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Zusammenfassung:	•It was measured a concentration dependence viscosity of copper-based solid solutions.•The viscosity strongly depends from the surface activity of second component.•The concentration dependence has a maximum for low-melting surface active impurities. We analyzed the changes in diffusional creep in polycrystalline copper depending on the impurities dissolved therein. The data on strain rate at high temperatures (>0.85 Tm) and low stresses (
ISSN:	0167-577X 1873-4979
DOI:	10.1016/j.matlet.2020.128811