Ultralow Dielectric Constant and High Temperature Resistance Composites Based on Self-Crosslinking Polysulfone and Hollow Glass Beads

In this work, ultralow dielectric constant (ultralow- k ) polysulfone (PSF) composites were prepared by adding hollow glass beads (HGB) modified with 1,3-divinyltetramethyldisiloxane (DVTM). The results indicated that the surface modification of HGB (m-HGB) effectively enhanced the interfacial compa...

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Veröffentlicht in:	Journal of electronic materials 2020-12, Vol.49 (12), p.7581-7588
Hauptverfasser:	Zhong, Jiachun, Zheng, Xiaoyi, He, Gang, Xia, Jialing, Pu, Zejun
Format:	Artikel
Sprache:	eng
Schlagworte:	Beads Characterization and Evaluation of Materials Chemistry and Materials Science Composite materials Crosslinking Dielectric loss Electronics and Microelectronics Fillers Frequency stability Glass transition temperature High temperature Instrumentation Insulation Integrated circuits Large scale integration Materials Science Mechanical properties Optical and Electronic Materials Permittivity Polysulfone resins Solid State Physics Substrates Thermal stability Ultra Large Scale Integration
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