Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: a review

Thermal management has been considered as a key issue for high-power electronics. Thermal interface materials (TIMs) play an extremely important role in the field of thermal management. Owing to their excellent insulation, mechanical properties and low processing costs, functional polymers have become the popular candidate for preparing TIMs. In order to develop high thermally conductive TIMs, the inorganic fillers with high thermal conductivity are generally composited with polymers. For this purpose, some key technologies are needed to improve the dispersibility of fillers to reduce interfacial thermal resistance and increase thermal conduction channels. This paper reviews recent progresses on effective methods for improving thermal conductivity, which mainly include filler functionalization and processing, filler hybridization and coating, filler orientation and network. After implementing these strategies, the interfacial interaction between fillers and polymers, the synergy effect of different fillers and the thermal conduction pathway inside the matrix can be highly improved, hence enhancing the thermal conductivity of TIMs. Graphic abstract