Micro‐Photovoltaics: Dust‐Sized High‐Power‐Density Photovoltaic Cells on Si and SOI Substrates for Wafer‐Level‐Packaged Small Edge Computers (Adv. Mater. 49/2020)

Micro‐Photovoltaics: Dust‐Sized High‐Power‐Density Photovoltaic Cells on Si and SOI Substrates for Wafer‐Level‐Packaged Small Edge Computers (Adv. Mater. 49/2020)

Advancement in microelectronics technology enables autonomous edge computing platforms the size of a dust mote. In article number 2004573, Ning Li and co‐workers show that dust‐sized photovoltaic cells on a Si substrate can be integrated using a wafer‐level‐packaging process with other chiplets to a...

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Veröffentlicht in:Advanced materials (Weinheim) 2020-12, Vol.32 (49), p.n/a
Hauptverfasser: Li, Ning, Han, Kevin, Spratt, William, Bedell, Stephen, Ren, Jinhan, Gunawan, Oki, Ott, John, Hopstaken, Marinus, Cabral, Cyril, Libsch, Frank, Subramanian, Chitra, Shahidi, Ghavam, Sadana, Devendra
Format: Artikel
Sprache:eng
Schlagworte:
compound semiconductors
Dust
Edge computing
heterogeneous integration
Materials science
Photovoltaic cells
photovoltaics
Silicon substrates
wafer‐level packaging
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Zusammenfassung:Advancement in microelectronics technology enables autonomous edge computing platforms the size of a dust mote. In article number 2004573, Ning Li and co‐workers show that dust‐sized photovoltaic cells on a Si substrate can be integrated using a wafer‐level‐packaging process with other chiplets to achieve high efficiency and high power density. This advancement unlocks the potential of large‐scale manufacturing of these compact integrated systems with high performance and low cost.
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.202070369