Design and Fabrication of 4H-Sic Mosfets with Optimized JFET and p-Body Design

In this paper, 4H-SiC planar MOSFETs were designed and fabricated. By using TCAD tool, the trade-off between on-resistance and maximum gate oxide electric field was optimized. With optimized gate oxide growth process, the gate oxide’s critical electric field of 9.8 MV/cm and the effective barrier he...

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Veröffentlicht in:Materials science forum 2020-11, Vol.1014, p.93-101
Hauptverfasser: Xiao, Hong Ling, Jiang, Li Juan, Ni, Wei Jiang, Wang, Xiao Liang, Wang, Quan, li, wei, Feng, Chun, Li, Ming Shan, Erlbacher, Tobias, Schlichting, Holger
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Sprache:eng
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Zusammenfassung:In this paper, 4H-SiC planar MOSFETs were designed and fabricated. By using TCAD tool, the trade-off between on-resistance and maximum gate oxide electric field was optimized. With optimized gate oxide growth process, the gate oxide’s critical electric field of 9.8 MV/cm and the effective barrier height of 2.57 eV between SiO2 and 4H-SiC were obtained. The field effective mobility with different p-body doping was compared and studied. The MOS interface state density of 1.12E12 cm-2eV-1 at EC - EIT = 0.21 eV and channel mobility of 19.3 cm2/Vs at VGS = 20 V were obtained. The fabricated MOSFET’s on-resistance of 6.4 mΩcm2 was obtained with hexagonal cell structure which is very consistent with the simulation results.
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.1014.93