Thermal performance evaluation of a thermoelectric cooler coupled with corona wind

•A thermoelectric cooler coupled with corona wind cooling system is developed.•The designed system shows excellent overall performance after optimization.•The optimal operating power of the system is proposed.•The coefficient of performance of the proposed system increased by 39.5%. The performance...

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Veröffentlicht in:Applied thermal engineering 2020-10, Vol.179, p.115753, Article 115753
Hauptverfasser: Wang, Jiang-Bo, Li, Xiao-Hua, Wang, Jing, Zhu, Tao, Bao, Ya-Chao
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Sprache:eng
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Zusammenfassung:•A thermoelectric cooler coupled with corona wind cooling system is developed.•The designed system shows excellent overall performance after optimization.•The optimal operating power of the system is proposed.•The coefficient of performance of the proposed system increased by 39.5%. The performance of a heat dissipation system that consists of a thermoelectric cooler (TEC) and corona wind generator is investigated. The combined thermoelectric cooling and corona discharge power on the system performance are explored via experiment and analytical analysis. The corona wind cooling system is optimized to achieve a higher corona wind velocity. Utilizing the TEC operating temperature, corona wind velocity, and power consumption, the study reveals that the proposed cooling system efficiency can be improved with an increase in these physical parameters. However, its performance reaches an optimal value once the Fourier conduction became a dominate factor when compared to the Peltier and Joule heating effects within the semiconductor elements of a TEC. Considering the cooling effect and power consumption, the optimal TEC and corona discharge power are determined to both be 1 W. The COP value of the proposed coupling system and the decrease of temperature are found to increase by 39.5% and 40%, respectively, indicating that the cooling efficiency of the system is improved after coupling. The knowledge gained from this study will provide a better understanding of various system parameters, including cooling temperature, power consumption and flow velocity in thermal management technology, as they are closely related in the field of electronic cooling system design.
ISSN:1359-4311
1873-5606
DOI:10.1016/j.applthermaleng.2020.115753