Analysis of via‐fed cylindrical dielectric resonator antennas

In this letter, a study of a feeding technique applicable to cylindrical dielectric resonator antennas is presented. The feeding technique analyzed is based on vias glued at the lateral wall of the cylindrical resonator. A series of parametric studies, in terms of the orientation, position and dimensions of the vias, has been carried out to assess the sensitivity to imperfections of the fabrication process on the antenna parameters. In order to validate the computational results, a prototype has been manufactured and measured with a spherical near‐field test facility. The results in terms of S‐parameters and radiation pattern are presented and good agreement between simulations and measurements has been obtained.