High temperature deformation and dynamic recrystallization behavior of AlCrCuFeNi high entropy alloy

The high temperature deformation and dynamic recrystallization characteristics of multicomponent AlCrCuFeNi high entropy alloy, composed of simple FCC and BCC phases were studied in detail in the temperature range of 900–1050 °C and in the strain rate range of 0.001–1 s−1 by generating contour maps of multiple models using a high temperature thermomechanical simulator test. The processing maps consisting of dissipation and instability maps show that the suitable areas for TMP are at 900–920 °C/10−1.5–10−3s−1 and 1000–1050 °C/10−2.5–10−3s−1. In contrast, two instability zones at (900–920 °C/10−0.75~1s−1 and 1000–1050 °C/10−0.5~1s−1) should be avoided during hot processing. EBSD analysis indicates that the volume fraction of dynamic recrystallization decreases with increasing deformation rate after hot compressive deformation at 1050 °C for different strain rates.