The Preliminary Study of the Addition Zinc in Tin-Copper Lead Free Solder

The Preliminary Study of the Addition Zinc in Tin-Copper Lead Free Solder

Sn-0.7Cu lead free solder has become an alternative material to replace Sn-Pb solder. However, it has the weakness of high melting point and poor corrosion behavior. Through the study, Sn-0.7-xZn microstructure and phase changes were studied through scanning electron microscope (SEM) and X-ray diffr...

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Veröffentlicht in:Materials science forum 2020-09, Vol.1010, p.104-108
Hauptverfasser: Wong, Wei Yee, Shamsudin, Rabiatul Adawiyah, Mohd Nazeri, Muhammad Firdaus, Masri, Mohamad Najmi
Format: Artikel
Sprache:eng
Schlagworte:
Corrosion tests
Electron microscopes
Lead content
Lead free
Melting points
Microstructure
Scanning electron microscopy
Tin
Tin base alloys
X-ray diffraction
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Zusammenfassung:Sn-0.7Cu lead free solder has become an alternative material to replace Sn-Pb solder. However, it has the weakness of high melting point and poor corrosion behavior. Through the study, Sn-0.7-xZn microstructure and phase changes were studied through scanning electron microscope (SEM) and X-ray diffraction (XRD). SEM result shows microstructure Cu6Sn5 is precipitated with rod like shape while CuZn is shown in bump oval shape whereas compounds that presented are Cu6Sn5 and Cu5Zn8 as shown in the XRD analysis result.
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.1010.104