Self‐Assemby: Wafer‐Scale High‐Quality Microtubular Devices Fabricated via Dry‐Etching for Optical and Microelectronic Applications (Adv. Mater. 37/2020)

In article number 2003252, Libo Ma, Oliver G. Schmidt, and co‐workers develop a dry‐release approach for the rolling up of strained nanomembranes, for the fabrication of electronic and optical devices. This approach results in in high yield, reproducibility, and uniformity, and represents a major step toward wafer‐scale integration of microdevices.