Low-temperature in-situ grown mullite whiskers toughened heat-resistant inorganic adhesive

Low-temperature in-situ grown mullite whiskers toughened heat-resistant inorganic adhesive

The temperature required for growth of mullite whiskers in heat-resistant adhesive was decreased to 700 °C based on solid-liquid-solid (S-L-S) mechanism. The bonding strength was increased by 23.1% (700 °C) ∼ 60.7% (1200 °C), and the maximal 32.3 MPa was achieved after sintered at 1200 °C. Moreover,...

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Veröffentlicht in:Journal of alloys and compounds 2020-09, Vol.836, p.155349, Article 155349
Hauptverfasser: Wang, Mingchao, Feng, Zhaojie, Zhai, Chenxi, Zhang, Jingfang, Li, Zepeng, Zhang, Haijun, Xu, Xiqing
Format: Artikel
Sprache:eng
Schlagworte:
Adhesives
Bonding strength
Fractures
Heat-resistant adhesive
In-situ
Low temperature
Lower temperature grow
Mullite
Mullite whiskers
S-L-S mechanism
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Zusammenfassung:The temperature required for growth of mullite whiskers in heat-resistant adhesive was decreased to 700 °C based on solid-liquid-solid (S-L-S) mechanism. The bonding strength was increased by 23.1% (700 °C) ∼ 60.7% (1200 °C), and the maximal 32.3 MPa was achieved after sintered at 1200 °C. Moreover, the whiskers-grown adhesive also displayed better anti-damage capacity, and multiple grading fractures occurred during the test procedure, which was mainly due to the pull-out mechanism.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2020.155349