Analysis of the Interstrand and Strand/Connector Resistance Relations in Wire Connection Systems
The basic function of wire connection systems is to assure a low resistance and a stable long-term electromechanical connection. The quality of this connection is determined by the quality of a large number of electromechanical interstrand and strand/connector contacts. The aim of this study is to a...
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Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2020-08, Vol.10 (8), p.1328-1336 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The basic function of wire connection systems is to assure a low resistance and a stable long-term electromechanical connection. The quality of this connection is determined by the quality of a large number of electromechanical interstrand and strand/connector contacts. The aim of this study is to analyze the parameters that influence the performance of wire connection systems with a new measurement method. A detailed analysis enables a deeper understanding and provides extended information about the inner electromechanical connection behavior. This analysis method can be used both for the fundamental research and the optimization of wire connection systems design. Hexagonal crimp connections with different wire surface conditions were analyzed. Furthermore, a numerical calculation method is introduced to describe the performance of wire connection systems in order to gain a deeper understanding of the results. |
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ISSN: | 2156-3950 2156-3985 |
DOI: | 10.1109/TCPMT.2020.3005075 |