Implantation of Silicon Ions into Sapphire: Low Doses

After the ion implantation of silicon into sapphire followed by high-temperature annealing, silicon and aluminosilicate precipitates are observed in the surface region of sapphire. X-ray measurements with the mapping of reciprocal space show the presence of a compressive stress with a –0.12% strain...

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Veröffentlicht in:Semiconductors (Woodbury, N.Y.) N.Y.), 2020-08, Vol.54 (8), p.912-915
Hauptverfasser: Belova, N. E., Shemardov, S. G., Fanchenko, S. S., Golovkova, E. A., Kondratev, O. A.
Format: Artikel
Sprache:eng
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Zusammenfassung:After the ion implantation of silicon into sapphire followed by high-temperature annealing, silicon and aluminosilicate precipitates are observed in the surface region of sapphire. X-ray measurements with the mapping of reciprocal space show the presence of a compressive stress with a –0.12% strain in the normal direction, and a tensile stress with a 0.2% strain in the R plane in this region. This reduces the lattice mismatch between sapphire and Si(100) and, thus, can improve the crystal quality of epitaxial Si films grown on such modified sapphire substrates.
ISSN:1063-7826
1090-6479
DOI:10.1134/S1063782620080060