Tunable chromaticity and high color rendering index of WLEDs with CaAlSiN3:Eu2+ and YAG:Ce3+ dual phosphor‐in‐silica‐glass

Phosphors‐in‐glass (PiG), which serves as a potential bi‐replacement of both phosphors and organic encapsulants in high‐power white light‐emitting diodes (WLEDs), has captured much attention due to its high thermal stability and excellent luminescent properties. However, due to the high‐temperature...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of the American Ceramic Society 2020-09, Vol.103 (9), p.4989-4998
Hauptverfasser: Huang, Ping, Zhao, Yuye, Wang, Jiancheng, Zheng, Yaru, Yang, Peng, Zheng, Qi, Gu, Shijia, Zhou, Beiying, Jiang, Wan, Wang, Lianjun
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Phosphors‐in‐glass (PiG), which serves as a potential bi‐replacement of both phosphors and organic encapsulants in high‐power white light‐emitting diodes (WLEDs), has captured much attention due to its high thermal stability and excellent luminescent properties. However, due to the high‐temperature sensitivity and the chemical reactions between phosphors with glass matrix, a variety of phosphors, especially red phosphors could be hardly dispersed into the glass without thermal quenching and decomposition, which greatly limits the improvement of color rendering index and chromaticity tunability of the WLEDs. In this study, adopting the mesoporous silica (FDU‐12) and commercial phosphors as raw materials, the phosphors‐in‐silica‐glasses (PiSGs) embedded with red phosphor CaAlSiN3:Eu2+ and yellow phosphor YAG:Ce3+ have been successfully prepared at low sintering temperature (950°C) and short preparation time (10 minutes) using spark plasma sintering. Owing to the well preservation of the originally emissive properties of the embedded phosphors, the warm WLEDs with tunable chromaticity and exhibited a superior performance with LE of 133 lm/W, CCT of 3970 K and CRI of 81 were fabricated by encapsulating the as‐prepared PiSGs on the blue chips. Moreover, the PiSG composite exhibits a high thermal conductivity up to 1.6 W/m·K.
ISSN:0002-7820
1551-2916
DOI:10.1111/jace.17210