Fabrication of Flexible Fine Through-hole Electrodes for Printed Devices using UV-NIL
Demand for printed electronic devices is increasing, likewise the attention being paid to through-hole electrodes as an integration approach. In comparison with wire bonding integration methods, through-hole electrodes occupy smaller surface areas and have lower power consumption rates. Generally, t...
Gespeichert in:
Veröffentlicht in: | Journal of Photopolymer Science and Technology 2020/07/01, Vol.33(5), pp.545-550 |
---|---|
Hauptverfasser: | , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Demand for printed electronic devices is increasing, likewise the attention being paid to through-hole electrodes as an integration approach. In comparison with wire bonding integration methods, through-hole electrodes occupy smaller surface areas and have lower power consumption rates. Generally, the diameters of through-holes fabricated in flexible substrates are larger than those developed in rigid substrates. In this study, ultraviolet nanoimprint lithography was used to fabricate microscale through-holes in a flexible substrate, and these holes were subsequently filled with silver ink to form through-hole electrodes. |
---|---|
ISSN: | 0914-9244 1349-6336 |
DOI: | 10.2494/photopolymer.33.545 |