Significant enhancement of thermal conductivity in graphite/polyester composite via interfacial π–π interaction

Interfacial thermal resistance between matrix and filler is one of the most serious factors hindering heat transfer in composites. Here, a type of liquid crystalline polyester (LCP) containing phenyl pendant groups was intended to blend with pristine graphite by interfacial interaction. The intensit...

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Veröffentlicht in:Polymer international 2020-04, Vol.69 (4), p.346-354
Hauptverfasser: Chen, Weilong, Wu, Kun, Tan, Zhiyou, Lu, Mangeng
Format: Artikel
Sprache:eng
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Zusammenfassung:Interfacial thermal resistance between matrix and filler is one of the most serious factors hindering heat transfer in composites. Here, a type of liquid crystalline polyester (LCP) containing phenyl pendant groups was intended to blend with pristine graphite by interfacial interaction. The intensity at 26.6° of the wide angle X‐ray diffraction pattern which exceeded that of pristine graphite indicated the existence of a strong interfacial π–π interaction. Both DSC and XRD tests showed that the ordered structure of the LCP matrix is directly affected by the mass fraction of graphite, indicating the interfacial interaction between LCP and graphite. By increasing the content of graphite, the thermal diffusivity showed a sharp increment by 1004%. The maximum thermal conductivity of the composite reached 28.613 W m−1 K−1, which was seven times that of traditional thermoplastic blended with graphite. Compared with the data calculated using effective medium theory, interfacial interaction plays a significant role in enhancing the thermal conductivity of the composites. Furthermore, the maximum tensile strength of this series of composites reached 13.3 MPa and the maximum Young's modulus reached 1067 MPa, exhibiting a potential guideline for further applications in flexible electronics. © 2019 Society of Chemical Industry Graphite, liquid crystalline phase, amorphous phase, phenyl pendant group, repeating units of graphite layer.
ISSN:0959-8103
1097-0126
DOI:10.1002/pi.5956