High-Power 4H-SiC MOSFET with an Epitaxial Buried Channel

A method for reducing the on-state resistance of a high-power 4 H -SiC metal-oxide-semiconductor field-effect transistor (MOSFET) by forming a buried channel via the growth of epitaxial layers on the surface of the heavily doped p -region is proposed. The features of the carrier transport in the epi...

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Veröffentlicht in:Semiconductors (Woodbury, N.Y.) N.Y.), 2020, Vol.54 (1), p.122-126
Hauptverfasser: Mikhaylov, A. I., Afanasyev, A. V., Ilyin, V. A., Luchinin, V. V., Reshanov, S. A., Schöner, A.
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container_issue 1
container_start_page 122
container_title Semiconductors (Woodbury, N.Y.)
container_volume 54
creator Mikhaylov, A. I.
Afanasyev, A. V.
Ilyin, V. A.
Luchinin, V. V.
Reshanov, S. A.
Schöner, A.
description A method for reducing the on-state resistance of a high-power 4 H -SiC metal-oxide-semiconductor field-effect transistor (MOSFET) by forming a buried channel via the growth of epitaxial layers on the surface of the heavily doped p -region is proposed. The features of the carrier transport in the epitaxial buried channel are considered in comparison with that fabricated by conventional technology. A more than threefold decrease in the resistance of the high-power MOSFET is achieved.
doi_str_mv 10.1134/S1063782620010157
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source Springer Nature - Complete Springer Journals
subjects Carrier transport
Epitaxial growth
Epitaxial layers
Epitaxy
Field effect transistors
Integrated circuits
Magnetic Materials
Magnetism
Metal oxide semiconductor field effect transistors
MOSFETs
Physics
Physics and Astronomy
Physics of Semiconductor Devices
Semiconductor chips
Semiconductor devices
Silicon carbide
title High-Power 4H-SiC MOSFET with an Epitaxial Buried Channel
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