Solder Joint Lifetime Modeling Under Random Vibrational Load Collectives
Solder joints used to connect electronic components such as ball grid array (BGAs) on printed circuit boards (PCBs) of engine control units are exposed to vibrational loads due to harsh road conditions and engine assembly operations. To assess the reliability of a solder BGA under arbitrary vibratio...
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| Veröffentlicht in: | JOM (1989) 2020-02, Vol.72 (2), p.898-905 |
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| container_title | JOM (1989) |
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| creator | Maniar, Youssef Konstantin, Georg Sharma, Anuj Binkele, Peter Schmauder, Siegfried |
| description | Solder joints used to connect electronic components such as ball grid array (BGAs) on printed circuit boards (PCBs) of engine control units are exposed to vibrational loads due to harsh road conditions and engine assembly operations. To assess the reliability of a solder BGA under arbitrary vibrational load collectives by means of finite element (FE) simulations, a generalized cumulative damage index is formulated and calibrated herein based on experimentally observed failures in high-cycle fatigue measurements. FE simulations using a fatigue material model are used to address the lifetime of BGA solder joints under vibrational testing at board and system level. The FE-based lifetime prognosis is discussed and compared with experimental statistical failure data of real solder joints obtained from electrodynamic shaker testing. |
| doi_str_mv | 10.1007/s11837-019-03947-1 |
| format | Article |
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To assess the reliability of a solder BGA under arbitrary vibrational load collectives by means of finite element (FE) simulations, a generalized cumulative damage index is formulated and calibrated herein based on experimentally observed failures in high-cycle fatigue measurements. FE simulations using a fatigue material model are used to address the lifetime of BGA solder joints under vibrational testing at board and system level. 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To assess the reliability of a solder BGA under arbitrary vibrational load collectives by means of finite element (FE) simulations, a generalized cumulative damage index is formulated and calibrated herein based on experimentally observed failures in high-cycle fatigue measurements. FE simulations using a fatigue material model are used to address the lifetime of BGA solder joints under vibrational testing at board and system level. The FE-based lifetime prognosis is discussed and compared with experimental statistical failure data of real solder joints obtained from electrodynamic shaker testing.</description><subject>Ball grid packaging</subject><subject>Chemistry/Food Science</subject><subject>Circuit boards</subject><subject>Computer simulation</subject><subject>Control equipment</subject><subject>Cumulative damage</subject><subject>Earth Sciences</subject><subject>Electronic components</subject><subject>Engine control</subject><subject>Engineering</subject><subject>Environment</subject><subject>Failure</subject><subject>Fatigue failure</subject><subject>Geometry</subject><subject>High cycle fatigue</subject><subject>Investigations</subject><subject>Load</subject><subject>Physics</subject><subject>Product development</subject><subject>Progress with Lead-Free Solders</subject><subject>Random vibration</subject><subject>Ratios</subject><subject>Reliability analysis</subject><subject>Reliability aspects</subject><subject>Soldered joints</subject><subject>Time series</subject><subject>Trends</subject><subject>Vibratory loads</subject><issn>1047-4838</issn><issn>1543-1851</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNpFkMFOwzAMQCMEEmPwA5wicQ7EddqkRzQBAxUhAeMapa2LMnXNaDq-n4whcbJlP1v2Y-wS5DVIqW8igEEtJJRCYqm0gCM2g1yhAJPDccplKiqD5pSdxbiWaUiVMGPLt9C3NPKn4IeJV76jyW-IP4eWej988tWw7766oQ0b_uHr0U0-DK7nVXAtX4S-p2by3xTP2Unn-kgXf3HOVvd374ulqF4eHhe3ldhCrieR16Zwte6aumk1laUiXUoqgBChcB02GVGhc1OgKqTErEGtdKJaINkpBzhnV4e92zF87ShOdh12Y7oo2izN6EwZrRKFBypux_QGjf8USLtXZg_KbFJmf5VZwB9VCl4X</recordid><startdate>20200201</startdate><enddate>20200201</enddate><creator>Maniar, Youssef</creator><creator>Konstantin, Georg</creator><creator>Sharma, Anuj</creator><creator>Binkele, Peter</creator><creator>Schmauder, Siegfried</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>3V.</scope><scope>4T-</scope><scope>4U-</scope><scope>7SR</scope><scope>7TA</scope><scope>7WY</scope><scope>7XB</scope><scope>883</scope><scope>88I</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8FL</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>FRNLG</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K60</scope><scope>K6~</scope><scope>KB.</scope><scope>L.-</scope><scope>M0F</scope><scope>M2P</scope><scope>PDBOC</scope><scope>PQBIZ</scope><scope>PQBZA</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope><scope>S0X</scope><orcidid>https://orcid.org/0000-0003-3026-2274</orcidid></search><sort><creationdate>20200201</creationdate><title>Solder Joint Lifetime Modeling Under Random Vibrational Load Collectives</title><author>Maniar, Youssef ; 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To assess the reliability of a solder BGA under arbitrary vibrational load collectives by means of finite element (FE) simulations, a generalized cumulative damage index is formulated and calibrated herein based on experimentally observed failures in high-cycle fatigue measurements. FE simulations using a fatigue material model are used to address the lifetime of BGA solder joints under vibrational testing at board and system level. The FE-based lifetime prognosis is discussed and compared with experimental statistical failure data of real solder joints obtained from electrodynamic shaker testing.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11837-019-03947-1</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0003-3026-2274</orcidid></addata></record> |
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| source | Springer Nature - Complete Springer Journals |
| subjects | Ball grid packaging Chemistry/Food Science Circuit boards Computer simulation Control equipment Cumulative damage Earth Sciences Electronic components Engine control Engineering Environment Failure Fatigue failure Geometry High cycle fatigue Investigations Load Physics Product development Progress with Lead-Free Solders Random vibration Ratios Reliability analysis Reliability aspects Soldered joints Time series Trends Vibratory loads |
| title | Solder Joint Lifetime Modeling Under Random Vibrational Load Collectives |
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