Solder Joint Lifetime Modeling Under Random Vibrational Load Collectives

Solder joints used to connect electronic components such as ball grid array (BGAs) on printed circuit boards (PCBs) of engine control units are exposed to vibrational loads due to harsh road conditions and engine assembly operations. To assess the reliability of a solder BGA under arbitrary vibrational load collectives by means of finite element (FE) simulations, a generalized cumulative damage index is formulated and calibrated herein based on experimentally observed failures in high-cycle fatigue measurements. FE simulations using a fatigue material model are used to address the lifetime of BGA solder joints under vibrational testing at board and system level. The FE-based lifetime prognosis is discussed and compared with experimental statistical failure data of real solder joints obtained from electrodynamic shaker testing.