The compression stress-strain behavior of Sn-Ag-Cu solder

The compression stress-strain behavior of Sn-Ag-Cu solder

The effect of the 125[degrees]C, 24 h aging treatment on the yield stress was also evaluated for the Sn-Ag-Cu solders tested at the slower strain rate of 4.2 x 10^sup -5^s^sup -1^. The mean yield-stress data are shown in Figure 4. The as-cast and aged samples are represented by solid symbols and ope...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:JOM (1989) 2003-06, Vol.55 (6), p.50-55
Hauptverfasser: Vianco, Paul T., Rejent, Jerome A., Martin, Joseph J.
Format: Artikel
Sprache:eng
Schlagworte:
Aging
Alloys
Copper
Deformation
Laboratories
Mechanical properties
Metal fatigue
Morphology
Solids
Tensile strength
Yield stress
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The effect of the 125[degrees]C, 24 h aging treatment on the yield stress was also evaluated for the Sn-Ag-Cu solders tested at the slower strain rate of 4.2 x 10^sup -5^s^sup -1^. The mean yield-stress data are shown in Figure 4. The as-cast and aged samples are represented by solid symbols and open symbols, respectively. The aging treatment generally resulted in lower yield-stress values over the range of test temperatures.
ISSN:1047-4838
1543-1851
DOI:10.1007/s11837-003-0141-8