Photoadhesive of Acrylates Containing Cross-links of Dipyridyl Disulfide

Diacrylate having a dipyridyl disulfide moiety is synthesized as a cross-linker for photoadhesive materials. The cross-linker has been used with 2-hydroxylethyl acrylate and a photoradical initiator to adhere a glass substrate with various kinds of substrates such as glass, copper, polyvinyl chloride, and aluminum. After 4 J/cm2 of UV irradiation at a wavelength of 365 nm, ca. 0.3-1.2 MPa of shear stress is recorded with the adhesive samples, which is superior to control adhesive samples having no dipyridyl disulfide moieties. From the results on XPS spectral measurements, it is indicated that both electron-rich sulfur atom and electron-poor nitrogen atom would contribute to the adhesion behavior.