Hybrid Organic–Inorganic Thermoelectric Materials and Devices

Hybrid organic–inorganic materials have been considered as a new candidate in the field of thermoelectric materials since the last decade owing to their great potential to enhance the thermoelectric performance by utilizing the low thermal conductivity of organic materials and the high Seebeck coeff...

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Veröffentlicht in:Angewandte Chemie International Edition 2019-10, Vol.58 (43), p.15206-15226
Hauptverfasser: Jin, Huile, Li, Jun, Iocozzia, James, Zeng, Xin, Wei, Pai‐Chun, Yang, Chao, Li, Nan, Liu, Zhaoping, He, Jr Hau, Zhu, Tiejun, Wang, Jichang, Lin, Zhiqun, Wang, Shun
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Sprache:eng
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Zusammenfassung:Hybrid organic–inorganic materials have been considered as a new candidate in the field of thermoelectric materials since the last decade owing to their great potential to enhance the thermoelectric performance by utilizing the low thermal conductivity of organic materials and the high Seebeck coefficient, and high electrical conductivity of inorganic materials. Herein, we provide an overview of interfacial engineering in the synthesis of various organic–inorganic thermoelectric hybrid materials, along with the dimensional design for tuning their thermoelectric properties. Interfacial effects are examined in terms of nanostructures, physical properties, and chemical doping between the inorganic and organic components. Several key factors which dictate the thermoelectric efficiency and performance of various electronic devices are also discussed, such as the thermal conductivity, electric transportation, electronic band structures, and band convergence of the hybrid materials. The heat is on: A new type of multi‐functional materials class, the organic–inorganic thermoelectric materials, have properties typical of both organic and inorganic materials. They have shown their versatile properties and tremendous potential in device and module design with high thermoelectric figures of merit, which result from their unique molecular design and interfacial engineering.
ISSN:1433-7851
1521-3773
DOI:10.1002/anie.201901106