Decomposition analysis of the multidisciplinary coupling in LED System-in-Package design using a DSM and a specification language

LED System-in-Package (SiP) aims to reduce manufacturing and material costs of LED lighting products through integration of components into one single package, based on semiconductor technology. This introduces multidisciplinary coupling in the system behavior which requires reconsideration of the existing LED design decomposition practice. This paper presents our method to do a decomposition analysis of the multidisciplinary coupling structure for an industry scale LED SiP design problem. The innovative aspect of our method is the use of a specification language to specify the input-output (binary) relationships between design variables, behavioral responses, objective and constraint responses. A design structure matrix, representing the mutual linkage, is automatically generated from the specification. The rows and columns of the DSM are subsequently re-ordered using partitioning and sequencing algorithms to provide insight in the coupling structure. The method is illustrated by means of a simplified example. Subsequently, the results for a recently manufactured LED SiP design prototype are presented.