Materials and micro drilling of high frequency and high speed printed circuit board: a review
The high-frequency and high-speed printed circuit board (PCB) with lower transmission loss, higher heat resistance, and better processability play increasing significant roles in mobile communication technology. However, because the materials and micro drilling process of high-frequency and high-spe...
Gespeichert in:
Veröffentlicht in: | International journal of advanced manufacturing technology 2019-01, Vol.100 (1-4), p.827-841 |
---|---|
Hauptverfasser: | , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The high-frequency and high-speed printed circuit board (PCB) with lower transmission loss, higher heat resistance, and better processability play increasing significant roles in mobile communication technology. However, because the materials and micro drilling process of high-frequency and high-speed PCB are very different from the traditional printed board, there are still many of key techniques to be explored in the future study. In this paper, the characteristics of high-frequency and high-speed PCB were presented. Researches concerning the design and wear ability of micro drill, the analysis of micro drilling force and temperature, and the quality of micro holes were reviewed. Finally, several key techniques and challenges regarding materials and micro drilling were suggested. |
---|---|
ISSN: | 0268-3768 1433-3015 |
DOI: | 10.1007/s00170-018-2711-5 |